Process Engineering -Devices-

Roll-to-Roll High-definition Patterning Process for Innovative High-function Film-based Devices

Based on printing and photoengraving technologies, Nissha’s micromachining process forms conductive patterns on the surface of film substrates, contributing to the thinness, lightness, and high functionality of electronic devices such as mobile devices, in-vehicle information systems, medical devices, and industrial equipment.

Process Engineering of Film-based Devices

Photo Etching

Nissha’s roll-to-roll double-side photo etching process meets the needs for fine patterning of diverse functional layers.

Process Engineering of Film-based Devices

Large Size Film

Nissha’s large photomask, boasting a standard size of 500 mm x 500 mm, meets the needs ranging from large-lot production of small devices to the processing of long-length film for large devices of 10 or more inches.

Fine Patterning

In the pursuit of ever finer patterns, Nissha has realized a minimum line width of 10 μm, providing new value to customer products such as narrow wiring circuits, high-density electrode patterns, and space-saving lot control markings.

Double-side Exposure

Nissha’s photo etching process enables patterning on both sides of the film. Precisely aligned double-side patterning contributes to the high integration density and thinness of devices.

Lamination Patterning

Nissha is equipped to meet a range of customer needs such as etching of ITO and Cu thin film, multilayer lamination of other metallic thin films, and high-precision patterning of functional electrodes and peripheral wiring.

Screen Printing

Nissha’s roll-to-roll screen printer, designed for patterning paste type of electrode materials, handles workpieces including Ag paste wiring patterns, or functional materials such as organic electrode materials, meeting the needs ranging from fine patterns at the 50 μm level to large patterns.

Nissha Screen Printing

Laser Processing

Nissha’s conductive film patterning technology is based on laser irradiation without photoengraving.
The laser ablation process enables even more detailed patterning of electrode films formed by screen printing.
Available fine pattern of Line/Space=30μm/40μm up to 500mm×500mm in size.

Nissha Laser Processing

Laminating / Die cut

Nissha’s laminating process for film-based devices, adhesive sheets, and insulation sheets enables precise bonding of multiple patterned sheets.
Nissha's Die cut process pierces laminated sheets sharply with high dimensional accuracy regardless of PET, COP, or polyimide base film.

Nissha Laminating / Punching

Module Processing Technology

Nissha Module Processing Technology

Module configurations and specifications vary by product.
Nissha draws on expertise cultivated through various of experience in processing and development of manufacturing equipment to be a one-stop provider of modules that meet customers’ needs.

FPC crimping

Nissha offers an FPC crimping process for addressing the various configurations of film-based devices.
Customers’ design requirements will be realized with unlimited specifications such as waterproofing and Anti-corrosion for wiring.
Single-sided crimp

Double-sided crimp

Top and bottom film crimp

Casing and functional material gluing

Nissha offers processes for bonding modules to film-based devices.
Bonding of polarizer and other functional film material is available, as are modules joined with rigid panels such as cover glass, plastic casing.
Using Printed design and IMD technologies, Nissha also provides decorated cover modules, bonding to curved panels, and bonding to large panels such as automotive center consoles. Nissha is open to discuss any possibilities to realize customers’ request.




LCD module gluing

As mobile devices change into smaller, sensors, antennas or other transparent functional layers are expected to mount on display in order to save the space.
Nissha is capable of gluing LCD modules on film-based devices. Optimization of the base film and coating material realizes film-based devices that minimize reflected light and express a clear jet black display.


Gas Sensors

Equipped with all Design Technologies Necessary for Gas Sensing

Gas element technology

Semiconductor gas sensors, other gas sensors, and applied equipment in recent years feature ever more advanced sensitivity and accuracy, and are used in an expanding range of fields. For accurate detection of the target gas, however, it is not enough that the sensor alone incorporates excellent technologies. We develop and manufacture everything from gas sensors alone to finished products such as modules, checkers, and analyzers. By being equipped with all elemental technologies necessary for gas sensing, we offer products that meet customer needs—high sensitivity, high accuracy, easy operability, and high reliability—in a broad range of fields including safety, the environment, health, medical care, automobiles and measurement.

Gas Sensor Design Technologies

Material Synthesis –The Key to Gas Sensing–

We prepare original materials to manufacture sensors tailored to the properties of the target gas. Material synthesis is the key to gas sensing and an area that best showcases the expertise of Nissha Group company.

Micromachining –Development of Small Size, Low Power Consumption Sensors–

Sensor miniaturization presents numerous advantages, from power and cost savings to quick response times and expanded scope of application. Nissha Group uses proprietary micromachining technologies in processes such as electrode machining and the formation of gas-sensing bodies to develop and manufacture small size, low power consumption sensors including MEMS* gas sensors.
* MEMS: Micro Electro Mechanical Systems

Facility Design –Manufacturing Equipment Designed In-house–

FIS factory

Micromachining and manufacturing gas sensors require special processes and equipment. Nissha Group designs its own equipment, such as automatic applicators of gas-sensing materials, to realize inimitable small size, high performance, and high reliability.

Product Design Technologies

Structural Design –The Optimal Design for each Product–

Each component of the gas sensor serves a purpose, down to the last tube. By tailoring various elements such as structure, layout, and materials to the purpose of the product, we can equip the gas sensor with unique functions.

Control Circuit Design –Realizing High Sensitivity and Low Noise–

Improvements in sensitivity pose a challenge: the gas sensor is that much more susceptible to noise, or gases other than the target gas present in the surrounding environment. Control circuit design is an important means of controlling this noise as well as ensuring user-friendliness of the product including the software. Nissha Group designs original control circuits to present products that play up the strengths and play down the weaknesses of various sensors.

Software Development

Nissha Group develops original software tailored to each product for easy operation even without specialized knowledge. The software can be customized according to customer needs.


Please feel free to contact us.

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