Exhibits "mui" at Salone Internazionale del Mobile booth of Hida Sangyo

April 6, 2017

Nissha Printing Co.,Ltd.

Nissha Printing Co., Ltd. (hereinafter "Nissha") is collaborating to exhibit "mui" at Salone Internazionale del Mobile booth of Hida Sangyo Co., Ltd.. This "mui" uses the material developed by the company.
* mui … A revolutionary aesthetic devices approach to user interface design for lighting and thermostat controls developed by Nissha.


About Hida Sangyo and "mui"

When we were looking for a beautiful material to be familiar with the interior conforming to the concept of "mui", Material ConneXion Tokyo introduced the raw material of cedar straight grain compression material developed by Hida Sangyo Co., Ltd.. This material is effective use of thinned wood, and features a beautiful wood grain after processing. It is also used in the company's KISARAGI series.
For Nissha's "mui", this approach will be the first step in verifying the installation of various furniture and materials that will be supposed in the future.

* Material ConneXion Tokyo is a library of advanced materials operated by M Crossing Co., Ltd. (Nissha Group).

Exhibition overview

Name Salone Internazionale del Mobile
Period April 4- 9, 2017
Venue Milan Fairgrounds, Rho (Italy)
Hall 6, Booth No.E36 (booth of Hida Sangyo)
Items to be displayed mui
Official website Salone Internazionale del Mobile
- The content of the web is information at press time, may change thereafter without notice. Due to risks and uncertainties, predictions may differ from actual results. Please be forewarned.
- "Nissha" is a generic name of Nissha Co., Ltd. and "Nissha Group" is a Nissha Co., Ltd. and its group companies.

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